Moore’s Law has shifted toward advanced packaging over the past few years, but the limits of that approach are just now ...

KLA KLAC is benefiting from strong advanced packaging growth as demand for more powerful chips continues to grow. The ...

Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond. Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more ...

Microplastics have become an alarming environmental concern, infiltrating ecosystems and even human bodies. Defined as plastic particles smaller than five millimetres, these tiny pollutants are found ...

Not long ago, greater integration between the processing and packaging functions was seen partly as an emerging trend and partly as an interesting possibility—an intriguing “if” out there on the ...

Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...

SCOTTSDALE, Ariz.--(BUSINESS WIRE)--N2 Packaging Systems, LLC (“N2 Packaging”) is the holder of various patents within the United States, Canada and other international markets relating to its ...

Ultra-thin and energy efficient displays that use organic compounds to emit light have been stirring up excitement in the consumer electronics industry for several years. Researchers have now ...

Packaging is one of the key factors that determine how consumers receive your brand. Your brand’s marketing strategy should include a strong focus on packaging, as it is one of the mediums through ...

When you toss a plastic bottle into your recycling bin, there’s no guarantee it actually gets recycled. In fact, odds are, it ...