As the semiconductor industry increasingly moves to chiplets, 2.5D/3D packaging, and heterogeneous integration, there are significant new challenges for test. Leaders like Teradyne have the ...
The data connection device under test in Figure 1 is characterized by comparing test signals sent into the link with signals measured at the link output. The differences between these two test signals ...
Sometimes, you only want to analyze those signal components that meet certain criteria or occur at certain times within an acquisition. This is not too difficult for a single acquisition, but what if ...
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